The conga-TEVAL/COMe 3.0 Evaluation Carrier Board for COM Express® Type 6 modules provides developers with a platform to jump-start the development of systems and applications based on COM Express specification.
The enhanced Version conga-TEVAL2 / COMe 3.0 supports new Features like M.2 Key B Slot for M.2 Modules size 3042, 2260 and 2280, USB 3.1, 3x Dual Mode Displayport and eDP.
The conga-TEVAL/COMe 3.0 evaluation carrier board from congatec routes all the COM Express® signals to standard interface connectors. The conga-TEVAL/COMe 3.0 supports COM Express® Compact and Basic modules using connector Pinout Type 6.
Hint: the conga-TEVAL / COMe 3.0 is also known as conga-TEVAL2.
The conga-TEVAL / COMe 3.0 supports COM Express Type 6 modules in the formats "Compact" and "Basic", making it the ideal platform for developing with congatec COM Express Type 6 modules such as conga-TC370, conga-TC175, conga -TCA5, conga-TS370, conga-TS175 or conga-TR4 and start.The conga-TEVAL supports COM Express type 6 CPU modules from congatec.
The conga-TEVAL/COMe 3.0 carrier board is designed based on the Type 6 pinout definition and it complies with COM Express Specification 3.0. The conga-TEVAL/COMe 3.0 provides most of the functional requirements for any embedded PC application. These functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA, USB 2.0, and Gigabit Ethernet. To ensure stable data throughput, the carrier board is equipped with two high performance connectors in accordance with the COM Express specification.
By combining the scalability of COM Express modules, the conga-TEVAL/COMe 3.0 carrier board provides developers with a platform to jump-start the development of systems and applications based on COM Express specification. This helps to reduce product design cycle and encourages rapid innovation in system design, to meet the ever-changing needs of the market. The various features and capabilities offered by the conga-TEVAL/COMe 3.0 makes it ideal for the integration of Compact and Basic form factor CPU modules.
New conga-TEVAL2 / conga-TEVAL / COMe 3.0 version:
The conga-TEVAL/COMe 3.0 carrier board is based on the Type 6 pinout definition and it complies with the COM Express 3.0 specification. The conga-TEVAL/COMe 3.0 provides most of the functional requirements for a typical embedded PC application. These functions include, but are not limited to a rich complement of high bandwidth serial interfaces such as PCI Express, SATA, USB 3.1, and Gigabit Ethernet. For stable data throughput, the carrier board is equipped with two high performance connectors in accordance with the COM Express 3.0 specification. Using the conga-TEVAL/COMe 3.0 carrier board helps developers to reduce product design cycle and allows rapid innovation in system design. The rich feature set and universal capabilities offered by the conga-TEVAL/COMe 3.0 makes it an ideal tool for the integration of COM Express Compact and Basic form factor processor modules.
COM Express Industry Standard for Computer-On-Modules
COM Express® modules provide a complete processor subsystem on a small form factor. The standardized COM Express® modules are mounted on a (usually customized) carrier board that provides the application-specific functionality. This design architecture enables the system integrator to focus on its value-add and offers benefits like optimized time-to-market cycles, performance scaleability and form-fit-and-function compatibilty across different processor versions.
MCTX Mobile & Embedded Computers GmbH provides COM Express® modules based on latest x86 architectures from Intel® and AMD®. These products can be applied to a wide variety of embedded computing applications and mobile computer systems.
The conga-TEVAL and conga-TEVAL2 carrier boards support both COM Express Type 6 formats ("BASIC" and "COMPACT"):
COM Express Type 6 COMPACT Modules are equipped with low-power processors on a board size of 95 mm x 95 mm. A wide range of x86 CPU platforms are available on the highly scalable COM Express Type 6 Compact form factor: from the Intel® Atom ™ family or AMD Embedded G-Series SoCs in the low end range to Intel® Core processors in the upper performance segment. COM Express Type 6 BASIC modules encapsulate x86 CPU cores with high performance and a thermal power dissipation of up to 75 watts. COM Express Basic Type 6 modules provide outstanding CPU and graphics performance.
The circuit diagrams of the conga-TEVAL and conga-TEVAL2 Evaluation Carrierboards are available free of charge, which facilitates the implementation of single function blocks in own COM Express Type 6 based carrier boards.