conga-B7E3 COM Express Type 7 Modules with AMD EPYC

Congatec's new conga-B7E3 COM Express Type 7 modules are equipped with AMD EPYC Embedded 3000 processors with 4, 8, 12, or 16 high-performance cores, support simultaneous multi-threading (SMT) and up to 96 GB of DDR4 2666 RAM in the COM Express Basic form factor and up to 1TB in full custom designs.

Measuring just 125 x 95 mm, the COM Express Basic Type 7 module supports up 4x 10 GbE and up to 32 PCIe Gen 3 lanes. For storage the module even integrates an optional 1 TB NVMe SSD and offers 2x SATA Gen 3.0 ports for conventional drives. Further interfaces include 4x USB 3.1 Gen 1, 4x USB 2.0 as well as 2x UART, GPIO, I2C, LPC and SPI. Attractive features also include seamless support of dedicated high-end GPUs and improved floating-point performance, which is essential for emerging AI and HPC applications. congatec also offers advanced cooling solutions for its COM Express Type 7 Server-on-Modules that match the processor, support fanless cooling even beyond 65 W TDP.

The conga-B7E3 COM Express Type 7 Server-On-Module is available with the following processor versions:

AMD EPYC™ Embedded 3000 Model 3451 (16 x 2.1 GHz, 32MB L3 cache, 100W)
AMD EPYC™ Embedded 3000 Model 3351 (12 x 1.90 GHz, 32MB L3 cache, 80W)
AMD EPYC™ Embedded 3000 Model 3251 (8 x 2.5 GHz, 16MB L3 cache, 55W)
AMD EPYC™ Embedded 3000 Model 3255 (8 x 2.5 GHz, 16MB L3 cache, 55W)
AMD EPYC™ Embedded 3000 Model 3201 (8 x 1.5 GHz, 16MB L3 cache, 30W)
AMD EPYC™ Embedded 3000 Model 3151 (4 x 2.7 GHz, 16MB L3 cache, 45W)
AMD EPYC™ Embedded 3000 Model 3101 (4 x 2.1 GHz, 8MB L3 cache, 35W)
Congatec's new conga-B7E3 COM Express Type 7 modules are equipped with AMD EPYC Embedded 3000 processors with 4, 8, 12, or 16 high-performance cores, support simultaneous multi-threading (SMT)... read more »
Close window
conga-B7E3 COM Express Type 7 Modules with AMD EPYC

Congatec's new conga-B7E3 COM Express Type 7 modules are equipped with AMD EPYC Embedded 3000 processors with 4, 8, 12, or 16 high-performance cores, support simultaneous multi-threading (SMT) and up to 96 GB of DDR4 2666 RAM in the COM Express Basic form factor and up to 1TB in full custom designs.

Measuring just 125 x 95 mm, the COM Express Basic Type 7 module supports up 4x 10 GbE and up to 32 PCIe Gen 3 lanes. For storage the module even integrates an optional 1 TB NVMe SSD and offers 2x SATA Gen 3.0 ports for conventional drives. Further interfaces include 4x USB 3.1 Gen 1, 4x USB 2.0 as well as 2x UART, GPIO, I2C, LPC and SPI. Attractive features also include seamless support of dedicated high-end GPUs and improved floating-point performance, which is essential for emerging AI and HPC applications. congatec also offers advanced cooling solutions for its COM Express Type 7 Server-on-Modules that match the processor, support fanless cooling even beyond 65 W TDP.

The conga-B7E3 COM Express Type 7 Server-On-Module is available with the following processor versions:

AMD EPYC™ Embedded 3000 Model 3451 (16 x 2.1 GHz, 32MB L3 cache, 100W)
AMD EPYC™ Embedded 3000 Model 3351 (12 x 1.90 GHz, 32MB L3 cache, 80W)
AMD EPYC™ Embedded 3000 Model 3251 (8 x 2.5 GHz, 16MB L3 cache, 55W)
AMD EPYC™ Embedded 3000 Model 3255 (8 x 2.5 GHz, 16MB L3 cache, 55W)
AMD EPYC™ Embedded 3000 Model 3201 (8 x 1.5 GHz, 16MB L3 cache, 30W)
AMD EPYC™ Embedded 3000 Model 3151 (4 x 2.7 GHz, 16MB L3 cache, 45W)
AMD EPYC™ Embedded 3000 Model 3101 (4 x 2.1 GHz, 8MB L3 cache, 35W)
Close filters
  •  
  •  
  •  
from to
No results were found for the filter!
Customized Embedded Computing Solutions Customized Embedded Computing Solutions
Umsetzung Ihrer Produktidee vom Konzept bis zur Serienlieferung .Die MCTX Mobile & Embedded Computers GmbH konzentriert sich auf die Integration von Embedded Computing Hardware in kundenspezifische Systemlösungen, wobei wir eng mit in diesem Technologiesegment führenden Herstellern zusammenarbeiten. Unser Portfolio erstreckt sich hierbei von der Technologieberatung, über die...
COM EXPRESS OEM Carrier Board Design Service COM EXPRESS OEM Carrier Board Design Service
Auf Anfrage bieten wir Ihnen die Entwicklung und Produktion Ihres anwendungs-spezifischen COM Express Carrier-Boards und weitere Services im Bereich der Systemintegration an. Hierbei greifen wir auf Erfahrungen und Funktionsbloecke aus bereits umgesetzten Designs zurueck. Die enge Verzahnung zwischen Entwicklung und Produktion ermöglicht es uns, kundenspezifische Systeme...
conga-X7EVAL/ind conga-X7EVAL/ind
Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No Board Management Controller (BMC). Industrial temperature range from -40°C to 85°C. To achieve a quick start with COM Express Type 7 modules congatec offers an evaluation carrier board, which routes all the signals to standard interface connectors. Internal connectors 32x PCIe...
Preferred Article Variant
conga-X7EVAL - COM Express Type 7 Evaluation Board conga-X7EVAL - COM Express Type 7 Evaluation Board
conga-X7EVAL Evaluation Carrier Board für congatec COM Express Typ 7-Module mit vier 10-GbE-SFP + -Faser / Kupfer-Ports. Das X7EVAL verfügt über einen Aspeed AST2500 Board Management Controller (BMC). Kommerzieller Temperaturbereich von 0 ° C bis 60 ° C. Um einen schnellen Start mit COM Express Typ 7-Modulen zu erreichen, bietet congatec das conga-X7EVAL Evaluation Carrier...
conga-B7E3/3101 conga-B7E3/3101
conga-B7E3/3101 - COM Express Type 7 Basic Modul mit AMD embedded EPYC 3101 (Snowy Owl) 4 core / 4 Thread CPU mit 2.1GHz bis zu 2.9GHz Core-Frequenz, 8MB L3 cache und 2666MT/s DDR4 SODIMM Speicherinterface für bis zu 64GB. TDP 35W
Engineering Kits & Rapid Prototyping Engineering Kits & Rapid Prototyping
For evaluation, benchmark tests and so that our customers can start developing their application software as quickly as possible, we first implement a development kit ("Software Target") based on the intended key components. In the simplest case, this is based on the evaluation board from the manufacturer of the CPU platform in combination with additional standard hardware....
High Speed COM Express Connector, 8mm, 440pin, 16+ Gbit/s High Speed COM Express Connector, 8mm, 440pin,...
440pin Dual-Row High Speed COM Express Carrier Board Steckverbinder für 8mm Board-zu-Board-Abstand und Datenraten von bis zu 16+ Gbit/s. Typ: ept 401-55503-51 Für COM Express Type 7, Type 6 & Type 2 CPU Module.
High Speed COM Express Connector, 5mm, 440pin, 16+ Gbit/s High Speed COM Express Connector, 5mm, 440pin,...
440pin (Dual Row) 16+ Gbit/s High Speed COM Express Carrier Board Steckverbinder für 5mm Board-zu-Board-Abstand. Typ: ept 401-51503-51 Für COM Express Type 7, Type 6 & Type 2 CPU Module.
High Speed COM Express Connector, 5mm, 220pin, 16+ Gbit/s High Speed COM Express Connector, 5mm, 220pin,...
220pin 16+ Gbit/s High Speed COM Express Carrierboard Steckverbinder für 5 mm Board-zu-Board Abstand. Typ: 401-51103-51 Für COM Express Module Type 7, Type 6, Type 2 und COM Express Mini Type 10 CPU Module.
High Speed COM Express Connector 8mm, 220pin, 16+ Gbit/s High Speed COM Express Connector 8mm, 220pin,...
220pin 16+ Gbit/s High Speed COM Express Carrier Board Steckverbinder für 8mm board-to-board distance. Typ: ept 401-55103-51 Für COM Express Module Type 7, Type 6, Type 2 und COM Express Mini Type 10 CPU Module.
conga-B7E3 Cooling Solutions conga-B7E3 Cooling Solutions
Heatspreader und Kuehlloesungen fuer congatec conga-B7E3 CPU-Boards. Der zu verwendende Heatspreader- / Cooling Solution-Typ muss zum jeweiligen CPU-board passen. Die verfuegbaren Varianten und die Montageanleitungen finden Sie im Benutzerhandbuch des jeweiligen CPU-Boards.
Viewed