conga-TC175 - COM Express Module with Intel® „Kaby Lake“ Core™ CPUs

The new conga TC175 COM Express Compact modules with Intel's 7th generation of Intel® Core™ SoC processors “Kaby Lake” are better than their predecessors.

Datasheet

It’s the second variant of the current 14nm microarchitecture. Compelling features include greater CPU performance, more dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fast 3D Xpoint-based Intel® Optane™ memory. Because of its compatibility with the previous generation, the widely improved microarchitecture can be integrated in existing embedded systems without additional design effort.

For developers it makes it particulary easy to integrate this new generation, depending on
standardized COM Express form factor, congatec's extensive industrial driver implementations as well as personal integration support and individual Embedded Design & Manufacturing services. Wherever fanless and completely sealed systems must offer high performance at 15 Watt TDP, target applications are found.
Feature set details

The new conga-TC175 COM Express Compact modules are equipped with 15 Watt dual-core variants of Gen 7 Intel® Core™ SoC processors. Specifically, these are the 2.8 GHz Intel® Core™ i7 7600U, the 2.6 GHz Intel® Core™ i5 7300U and the 2.4 GHz Intel® Core™ i3 7100U processors as well as the Intel® Celeron® 3695U processor with 2.2 GHz. The TDP of all variants is configurable from 7.5 to15 Watts, which makes it easier to adapt the application to the energy concept of the system. All modules support up to 32 GB dual channel memory which for DDR4 provides significantly more bandwidth and better energy efficiency than current conventional DDR3L implementations. The Intel® Gen 9 HD Graphics 620 offers high graphics performance with latest DirectX 12 capabilities and supports up to three independent displays with up to 4k @ 60 Hz via eDP 1.4, DisplayPort 1.2 and HDMI 2.0a. Thanks to hardware-accelerated 10-bit encoding/decoding and high dynamic range of HEVC and VP9, HD streams are becoming more vivid and lifelike in both directions. The new computer modules from congatec support the COM Express Type 6 pinout with PCI Express Gen 3.0, USB 3.0 and 2.0, SATA Gen 3, Gigabit Ethernet, and low-speed interfaces such as LPC, I²C and UART. Customized integration support, a comprehensive range of accessories and optional Embedded Design & Manufacturing services for application specific carrier board and system designs are also available.

The new conga TC175 COM Express Compact modules with Intel's 7th generation of Intel® Core™ SoC processors “Kaby Lake” are better than their predecessors. Datasheet It’s... read more »
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conga-TC175 - COM Express Module with Intel® „Kaby Lake“ Core™ CPUs

The new conga TC175 COM Express Compact modules with Intel's 7th generation of Intel® Core™ SoC processors “Kaby Lake” are better than their predecessors.

Datasheet

It’s the second variant of the current 14nm microarchitecture. Compelling features include greater CPU performance, more dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fast 3D Xpoint-based Intel® Optane™ memory. Because of its compatibility with the previous generation, the widely improved microarchitecture can be integrated in existing embedded systems without additional design effort.

For developers it makes it particulary easy to integrate this new generation, depending on
standardized COM Express form factor, congatec's extensive industrial driver implementations as well as personal integration support and individual Embedded Design & Manufacturing services. Wherever fanless and completely sealed systems must offer high performance at 15 Watt TDP, target applications are found.
Feature set details

The new conga-TC175 COM Express Compact modules are equipped with 15 Watt dual-core variants of Gen 7 Intel® Core™ SoC processors. Specifically, these are the 2.8 GHz Intel® Core™ i7 7600U, the 2.6 GHz Intel® Core™ i5 7300U and the 2.4 GHz Intel® Core™ i3 7100U processors as well as the Intel® Celeron® 3695U processor with 2.2 GHz. The TDP of all variants is configurable from 7.5 to15 Watts, which makes it easier to adapt the application to the energy concept of the system. All modules support up to 32 GB dual channel memory which for DDR4 provides significantly more bandwidth and better energy efficiency than current conventional DDR3L implementations. The Intel® Gen 9 HD Graphics 620 offers high graphics performance with latest DirectX 12 capabilities and supports up to three independent displays with up to 4k @ 60 Hz via eDP 1.4, DisplayPort 1.2 and HDMI 2.0a. Thanks to hardware-accelerated 10-bit encoding/decoding and high dynamic range of HEVC and VP9, HD streams are becoming more vivid and lifelike in both directions. The new computer modules from congatec support the COM Express Type 6 pinout with PCI Express Gen 3.0, USB 3.0 and 2.0, SATA Gen 3, Gigabit Ethernet, and low-speed interfaces such as LPC, I²C and UART. Customized integration support, a comprehensive range of accessories and optional Embedded Design & Manufacturing services for application specific carrier board and system designs are also available.

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conga-TC175/3965U conga-TC175/3965U
COM Express Type 6 Compact module with Intel® Celeron® 3965U dual core processor with 2.2GHz, 2MB Intel® Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
From €240.00 *
conga-TEVAL/COMe 3.0 COM Express Type 6 Evaluation Carrier Board conga-TEVAL/COMe 3.0 COM Express Type 6...
The conga-TEVAL/COMe 3.0 Evaluation Carrier Board for COM Express® Type 6 modules provides developers with a platform to jump-start the development of systems and applications based on COM Express specification. The enhanced Version conga-TEVAL2 / COMe 3.0 supports new Features like M.2 Key B Slot for M.2 Modules size 3042, 2260 and 2280, USB 3.1, 3x Dual Mode Displayport...
€399.00 *
Cooling Solution TC170/CSA-B Cooling Solution TC170/CSA-B
Standard active cooling solution for COM Express modules conga-TC97, TC170, TC175 and TC370. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
€50.00 *
DDR4-SODIMM-2400 (8GB) DDR4-SODIMM-2400 (8GB)
DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
€39.00 *
Heatspreader TC170/HSP-B Heatspreader TC170/HSP-B
Standard heatspreader for COM Express modules conga-TC97, TC170, TC175 and TC370. All standoffs are with 2.7mm bore hole.
€33.00 *
High Speed COM Express Connector 8mm, 220pin, 16+ Gbit/s High Speed COM Express Connector 8mm, 220pin,...
220pin 16+ Gbit/s High Speed COM Express Carrier Board Connector for 8mm board-to-board distance. Type: ept 401-55103-51 For COM Express Type 7, Type 6, Type 2 and COM Express Mini Type 10 CPU Modules.
Content 1 Stück
€18.45 *
High Speed COM Express Connector, 8mm, 440pin, 10+ Gbit/s High Speed COM Express Connector, 8mm, 440pin,...
440pin Dual-Row High Speed COM Express Carrier Board Connector for 8mm board-to-board height and data rates up to 10+ Gbit/s. Type: ept 401-55501-51 For COM Express Type 6 & Type 2 CPU Module.
Content 1 Stück
€14.95 *
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