COM Express Type 7 Server-On-Modules

The COM Express Type 7 modules defined by the PICMG consortium (www.picmg. org) trade all audio and video interfaces for four 10G Ethernet ports and a total of 32 PCI Express lanes in order to support enhanced micro servers, high performance embedded computers and other server Type applications that only allow for low power consumption but require high computing performance and communication throughput.

The new COM Express 3.0 standard that includes the new COM Express Type 7 Pinout– is introducing new Server-on-Modules with Intel® Xeon® D processors (codename Broadwell) parallel to the preview release of the COM Express Type 7 specification. Based on the world-leading COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 gigabytes of DDR4 ECC RAM.

The application-ready, modular core of the long-term available congatec Server-on-Modules offers a standardized footprint, carrier board interfaces and a cooling concept, which significantly simplifies system designs – accelerating the launch of new, robust server technology. Plus, future performance upgrades can be carried out in a remarkably simple and cost-saving way, as only the Server-on-Module needs to be exchanged.

The COM Express Type 7 modules defined by the PICMG consortium (www.picmg. org) trade all audio and video interfaces for four 10G Ethernet ports and a total of 32 PCI Express lanes in order to... read more »
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COM Express Type 7 Server-On-Modules

The COM Express Type 7 modules defined by the PICMG consortium (www.picmg. org) trade all audio and video interfaces for four 10G Ethernet ports and a total of 32 PCI Express lanes in order to support enhanced micro servers, high performance embedded computers and other server Type applications that only allow for low power consumption but require high computing performance and communication throughput.

The new COM Express 3.0 standard that includes the new COM Express Type 7 Pinout– is introducing new Server-on-Modules with Intel® Xeon® D processors (codename Broadwell) parallel to the preview release of the COM Express Type 7 specification. Based on the world-leading COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 gigabytes of DDR4 ECC RAM.

The application-ready, modular core of the long-term available congatec Server-on-Modules offers a standardized footprint, carrier board interfaces and a cooling concept, which significantly simplifies system designs – accelerating the launch of new, robust server technology. Plus, future performance upgrades can be carried out in a remarkably simple and cost-saving way, as only the Server-on-Module needs to be exchanged.

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Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No Board Management Controller (BMC). Industrial temperature range from -40°C to 85°C. To achieve a quick start with COM Express Type 7 modules congatec offers an evaluation carrier board, which routes all the signals to standard interface connectors. Internal connectors 32x PCIe...
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conga-X7EVAL - COM Express Type 7 Evaluation Board conga-X7EVAL - COM Express Type 7 Evaluation Board
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COM Express Type 7 Basic Modul mit Intel Pentium D1508 CPU mit 2 Cores, 2.2GHz bis zu 2.6GHz Core-Frequenz, 3MB Cache mit Intel Cache Allocation Technology und 1866 MT/s dual channel DDR4 Speicherinterface für bis zu 48GB SODIMM Speicher. Zwei 10GbE KR interface ports. 25W TDP, "commercial" Temperaturbereich.
Preferred Article Variant
conga-B7AC/A-C3308 conga-B7AC/A-C3308
COM Express Type 7 Basic Modul mit Intel Atom C3308 CPU mit 2 Cores, 1.6 GHz Core-Frequenz, 4MB Cache und 2133 MT/s dual channel DDR4 Speicherinterface für bis zu 64 GByte. Vier 2.5GbE KX interface ports. 9.5W TDP, "commercial" Temperaturbereich.
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