COM Express Type 7 Server-On-Modules

The COM Express Type 7 modules defined by the PICMG consortium (www.picmg. org) trade all audio and video interfaces for four 10G Ethernet ports and a total of 32 PCI Express lanes in order to support enhanced micro servers, high performance embedded computers and other server Type applications that only allow for low power consumption but require high computing performance and communication throughput.

The new COM Express 3.0 standard that includes the new COM Express Type 7 Pinout– is introducing new Server-on-Modules with Intel® Xeon® D processors (codename Broadwell) parallel to the preview release of the COM Express Type 7 specification. Based on the world-leading COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 gigabytes of DDR4 ECC RAM.

The application-ready, modular core of the long-term available congatec Server-on-Modules offers a standardized footprint, carrier board interfaces and a cooling concept, which significantly simplifies system designs – accelerating the launch of new, robust server technology. Plus, future performance upgrades can be carried out in a remarkably simple and cost-saving way, as only the Server-on-Module needs to be exchanged.

The COM Express Type 7 modules defined by the PICMG consortium (www.picmg. org) trade all audio and video interfaces for four 10G Ethernet ports and a total of 32 PCI Express lanes in order to... read more »
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COM Express Type 7 Server-On-Modules

The COM Express Type 7 modules defined by the PICMG consortium (www.picmg. org) trade all audio and video interfaces for four 10G Ethernet ports and a total of 32 PCI Express lanes in order to support enhanced micro servers, high performance embedded computers and other server Type applications that only allow for low power consumption but require high computing performance and communication throughput.

The new COM Express 3.0 standard that includes the new COM Express Type 7 Pinout– is introducing new Server-on-Modules with Intel® Xeon® D processors (codename Broadwell) parallel to the preview release of the COM Express Type 7 specification. Based on the world-leading COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 gigabytes of DDR4 ECC RAM.

The application-ready, modular core of the long-term available congatec Server-on-Modules offers a standardized footprint, carrier board interfaces and a cooling concept, which significantly simplifies system designs – accelerating the launch of new, robust server technology. Plus, future performance upgrades can be carried out in a remarkably simple and cost-saving way, as only the Server-on-Module needs to be exchanged.

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Customized Embedded Computing Solutions Customized Embedded Computing Solutions
Implementation of your product idea from concept to serial delivery .MCTX Mobile & Embedded Computers GmbH focuses on the integration of embedded computing hardware into customer-specific system solutions, whereby we work closely with leading manufacturers in this technology segment. Our portfolio ranges from technology consulting and the delivery of key components to the...
COM EXPRESS OEM Carrier Board Design Service COM EXPRESS OEM Carrier Board Design Service
On request, we can offer you the development and production of your application-specific COM Express Carrier Board and other services in the area of system integration. Here we fall back on experience and function blocks from designs that have already been implemented. The close interaction between development and production enables us to implement customer-specific systems...
conga-X7EVAL/ind conga-X7EVAL/ind
Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No Board Management Controller (BMC). Industrial temperature range from -40°C to 85°C. To achieve a quick start with COM Express Type 7 modules congatec offers an evaluation carrier board, which routes all the signals to standard interface connectors. Internal connectors 32x PCIe...
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conga-X7EVAL - COM Express Type 7 Evaluation Board conga-X7EVAL - COM Express Type 7 Evaluation Board
conga-X7EVAL Evaluation Carrier Board für congatec COM Express Typ 7-Module mit vier 10-GbE-SFP + -Faser / Kupfer-Ports. Das X7EVAL verfügt über einen Aspeed AST2500 Board Management Controller (BMC). Kommerzieller Temperaturbereich von 0 ° C bis 60 ° C. Um einen schnellen Start mit COM Express Typ 7-Modulen zu erreichen, bietet congatec das conga-X7EVAL Evaluation Carrier...
conga-B7E3/3101 conga-B7E3/3101
conga-B7E3/3101 - COM Express Type 7 Basic Modul mit AMD embedded EPYC 3101 (Snowy Owl) 4 core / 4 Thread CPU mit 2.1GHz bis zu 2.9GHz Core-Frequenz, 8MB L3 cache und 2666MT/s DDR4 SODIMM Speicherinterface für bis zu 64GB. TDP 35W
conga-B7XD/P-D1508 conga-B7XD/P-D1508
COM Express Type 7 Basic Modul mit Intel Pentium D1508 CPU mit 2 Cores, 2.2GHz bis zu 2.6GHz Core-Frequenz, 3MB Cache mit Intel Cache Allocation Technology und 1866 MT/s dual channel DDR4 Speicherinterface für bis zu 48GB SODIMM Speicher. Zwei 10GbE KR interface ports. 25W TDP, "commercial" Temperaturbereich.
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conga-B7AC/A-C3308 conga-B7AC/A-C3308
COM Express Type 7 Basic Modul mit Intel Atom C3308 CPU mit 2 Cores, 1.6 GHz Core-Frequenz, 4MB Cache und 2133 MT/s dual channel DDR4 Speicherinterface für bis zu 64 GByte. Vier 2.5GbE KX interface ports. 9.5W TDP, "commercial" Temperaturbereich.
Engineering Kits & Rapid Prototyping Engineering Kits & Rapid Prototyping
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DDR4-SODIMM-2400 (16GB) DDR4-SODIMM-2400 (16GB)
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High Speed COM Express Connector, 8mm, 440pin, 16+ Gbit/s High Speed COM Express Connector, 8mm, 440pin,...
440pin Dual-Row High Speed COM Express Carrier Board Steckverbinder für 8mm Board-zu-Board-Abstand und Datenraten von bis zu 16+ Gbit/s. Typ: ept 401-55503-51 Für COM Express Type 7, Type 6 & Type 2 CPU Module.
High Speed COM Express Connector, 5mm, 440pin, 16+ Gbit/s High Speed COM Express Connector, 5mm, 440pin,...
440pin (Dual Row) 16+ Gbit/s High Speed COM Express Carrier Board Steckverbinder für 5mm Board-zu-Board-Abstand. Typ: ept 401-51503-51 Für COM Express Type 7, Type 6 & Type 2 CPU Module.
High Speed COM Express Connector, 5mm, 220pin, 16+ Gbit/s High Speed COM Express Connector, 5mm, 220pin,...
220pin 16+ Gbit/s High Speed COM Express Carrierboard Steckverbinder für 5 mm Board-zu-Board Abstand. Typ: 401-51103-51 Für COM Express Module Type 7, Type 6, Type 2 und COM Express Mini Type 10 CPU Module.
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