Implementation of your product idea from concept to serial delivery .MCTX Mobile & Embedded Computers GmbH focuses on the integration of embedded computing hardware into customer-specific system solutions, whereby we work closely with leading manufacturers in this technology segment. Our portfolio ranges from technology consulting and the delivery of key components to the...

Highly integrated electronics platform for x86 and ARM-based multi-display applications and touch control units The MX-Q7-MM2 enables a large number of common IO scenarios in the area of visualization and user interface applications - with an optimized unit price and without costly hardware designs. The rapid rise in market penetration of tablet PCs in the consumer market...

On request, we can offer you the development and production of your application-specific COM Express Carrier Board and other services in the area of system integration. Here we fall back on experience and function blocks from designs that have already been implemented. The close interaction between development and production enables us to implement customer-specific systems...

On request, we offer you the development and production of your application-specific SMARC carrier board and other services in the area of system integration. Here we fall back on experience and function blocks from designs that have already been implemented. The close interaction between development and production enables us to implement customer-specific systems very...

conga-SKIT/APL ist ein Entwicklungskit für den schnellen Projekteinstieg mit SMARC 2.0 Modulen von congatec. Das Kit beinhaltet neben einem conga-SA5/E3950-8G eMMC32 SPKL-AC CPU-Modul (high-end Version der conga-SA5 Produktfamilie mit Bluetooth und WLAN) auch das congatec conga-SEVAL SMARC 2.0 Evaluation Carrier Board , Kühllösung, Adapter und Anschlusskabel. Datenblatt:...

Evaluation Carrier Board for COM-HPC ClientType Modules

This complete kit provides the ability to start evaluating Qseven®modules immediately. Qseven Starter Kit All accessories out of the box Immediate evaluation for Qseven Contents: 007003 conga-QEVAL/Qseven 2.0 Evaluation board for Qseven modules (rev. B.4) 011115 conga-LDVI/EPI LVDS to DVI converter board with EEPROM 033331 cab-LVDV-DAT-34-15 34-pin, 1mm pitch, 15cm ribbon...

COM-HPC Size B module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

COM Express Type 6 Basic module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

COM Express Type 6 Compact module from congatec based on Intel® Core™ i7-12800HE processor with 6 P-cores 2.4GHz up to 4.6GHz and 8 E-cores 1.8GHz up to 3.5GHz | 24MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (H-Series)

COM-HPC Size A module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Industrial temperature range.

Thin Mini-ITX board auf Basis Intel Core i7-8665UE Quad-Core CPU mit 1.7GHz, 8MB Intel Smart Cache, GT2 Grafik und 2400MT/s dual channel DDR4 Speicherinterface (Whiskey Lake).