COM Express Type 6 Basic CPU Modules

The COM Express Type 6 modules in Basic Format are used to shred x86 CPU cores with high performance and a thermal power loss of up to 75 watts.

The COM Express Type 6 modules in Basic Format are used to shred x86 CPU cores with high performance and a thermal power loss of up to 75 watts. read more »
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COM Express Type 6 Basic CPU Modules

The COM Express Type 6 modules in Basic Format are used to shred x86 CPU cores with high performance and a thermal power loss of up to 75 watts.

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Customized Embedded Computing Solutions Customized Embedded Computing Solutions
Implementation of your product idea from concept to serial delivery .MCTX Mobile & Embedded Computers GmbH focuses on the integration of embedded computing hardware into customer-specific system solutions, whereby we work closely with leading manufacturers in this technology segment. Our portfolio ranges from technology consulting and the delivery of key components to the...
COM EXPRESS OEM Carrier Board Design Service COM EXPRESS OEM Carrier Board Design Service
On request, we can offer you the development and production of your application-specific COM Express Carrier Board and other services in the area of system integration. Here we fall back on experience and function blocks from designs that have already been implemented. The close interaction between development and production enables us to implement customer-specific systems...
conga-TS570/W-11865MRE COM Express Basic Type 6 from congatec conga-TS570 product line. Part# 050710 conga-TS570/W-11865MRE
COM Express Type 6 Basic module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range
Preferred Article Variant
conga-TEVAL/COMe 3.0 COM Express Type 6 Evaluation Carrier Board conga-TEVAL/COMe 3.0 COM Express Type 6...
Die Version conga-TEVAL2 / COMe 3.0 unterstützt neue Features wie z.B. einen M.2 Key B Steckplatz für Modulgrößen 3042, 2260 und 2280, USB 3.1, 3x Dual Mode Displayport und eDP. Für den schnellen Projektstart mit COM Express Typ 6 "Basic" und "Compact" CPU-Modulen bietet congatec das conga-TEVAL / COMe 3.0 Evaluation Carrier Board, das alle COM Express Signale an Standard-PC...
conga-TS175/i3-7102E conga-TS175/i3-7102E
COM Express Type 6 Basic Modul mit Intel Core i3-7102E Dual-Core CPU mit 2.1GHz, 3MB Intel Smart Cache, GT2 Grafik und 2400MT/s dual channel DDR4 Speicherinterface (Intel Kaby Lake-H). Chipset HM175 mit support für Intel Optane Speicher.
conga-TR4/V1202B conga-TR4/V1202B
COM Express Type 6 Basic Modul mit AMD embedded V-Series V1202B (Great Horned Owl) Dual-Core CPU mit 2.3GHz bis zu 3.2GHz Core-Frequenz, 1MB L2-Cache und 2400MT/s DDR4 SODIMM Speicherinterface für bis zu 32GB. Radeon Vega integrierten Grafik core mit 3 CU. TDP 12-25W.
conga-TS370/G4932E conga-TS370/G4932E
COM Express Type 6 Basic Modul mit Coffeelake-H Refresh Intel Celeron CPU G4932E, 25W Dual-Core CPU mit 1.9GHz, 2MB L2 cache, GT2 Grafik und 2666MT/s dual channel DDR4 Speicherinterface. Chipset HM370. TPM 2.0.
Engineering Kits & Rapid Prototyping Engineering Kits & Rapid Prototyping
For evaluation, benchmark tests and so that our customers can start developing their application software as quickly as possible, we first implement a development kit ("Software Target") based on the intended key components. In the simplest case, this is based on the evaluation board from the manufacturer of the CPU platform in combination with additional standard hardware....
High Speed COM Express Connector, 8mm, 440pin, 16+ Gbit/s High Speed COM Express Connector, 8mm, 440pin,...
440pin Dual-Row High Speed COM Express Carrier Board Steckverbinder für 8mm Board-zu-Board-Abstand und Datenraten von bis zu 16+ Gbit/s. Typ: ept 401-55503-51 Für COM Express Type 7, Type 6 & Type 2 CPU Module.
High Speed COM Express Connector, 5mm, 440pin, 16+ Gbit/s High Speed COM Express Connector, 5mm, 440pin,...
440pin (Dual Row) 16+ Gbit/s High Speed COM Express Carrier Board Steckverbinder für 5mm Board-zu-Board-Abstand. Typ: ept 401-51503-51 Für COM Express Type 7, Type 6 & Type 2 CPU Module.
High Speed COM Express Connector, 5mm, 220pin, 16+ Gbit/s High Speed COM Express Connector, 5mm, 220pin,...
220pin 16+ Gbit/s High Speed COM Express Carrierboard Steckverbinder für 5 mm Board-zu-Board Abstand. Typ: 401-51103-51 Für COM Express Module Type 7, Type 6, Type 2 und COM Express Mini Type 10 CPU Module.
High Speed COM Express Connector 8mm, 220pin, 16+ Gbit/s High Speed COM Express Connector 8mm, 220pin,...
220pin 16+ Gbit/s High Speed COM Express Carrier Board Steckverbinder für 8mm board-to-board distance. Typ: ept 401-55103-51 Für COM Express Module Type 7, Type 6, Type 2 und COM Express Mini Type 10 CPU Module.
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