conga-TR4 - COM Express Type 6 Modul with AMD Ryzen™ Embedded V1000

The conga-TR4 COM Express Type 6 CPU module based on the new AMD Ryzen ™ Embedded V1000 processors defines a new performance class for high-end embedded COMs - up to 3x more GPU performance than competitive solutions.

The conga-TR4 high-performance modules offer up to 52% higher computing performance, reaching up to 3.75 GHz and, thanks to symmetrical multiprocessing, particularly high parallel processing performance. They support up to 32 GB of energy-efficient and fast dual-channel DDR4 memory with up to 3200 MT / s, optionally also with ECC for highest data security. With a TDP scalable from 12 to 54 watts, the congatec modules based on these new processors benefit from numerous performance jumps at a given TDP as well as a huge SWaP-C optimization potential (size, weight, power and costs) with high graphics performance.

conga-TR4 Feature Highlights

- AMD V1000 processor Series with “Zen” core architecture
- up to 4 CPU cores
- “Vega” GPU with improved graphic performance
- Up to 32GByte dual channel DDR4 3200MT/s memory
- TDP scalable down to 12W
- up to 4 x 4K DP / eDP

The conga-TR4 COM Express Basic modules are therefore predestined for the development of embedded computing systems with impressive graphics performance, such as medical imaging systems, professional broadcasting, infotainment and gaming systems, digital signage systems, control centers and video surveillance, optical quality control and 3D simulators.

The conga-TR4 COM Express Type 6 Basic CPU-Module is available with the following CPU versions of the AMD Ryzen Embedded V1000 processor family:

AMD V1807B (4 x 3.35 GHz, 2MB L2 cache, 45W)
AMD V1756B (4 x 3.25 GHz, 2MB L2 cache, 45W)
AMD V1605B (4 x 2.0 GHz, 2MB L2 cache, 15W)
AMD V1202B (2 x 2.5 GHz, 1MB L2 cache, 15W)
The conga-TR4 COM Express Type 6 CPU module based on the new AMD Ryzen ™ Embedded V1000 processors defines a new performance class for high-end embedded COMs - up to 3x more GPU performance than... read more »
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conga-TR4 - COM Express Type 6 Modul with AMD Ryzen™ Embedded V1000

The conga-TR4 COM Express Type 6 CPU module based on the new AMD Ryzen ™ Embedded V1000 processors defines a new performance class for high-end embedded COMs - up to 3x more GPU performance than competitive solutions.

The conga-TR4 high-performance modules offer up to 52% higher computing performance, reaching up to 3.75 GHz and, thanks to symmetrical multiprocessing, particularly high parallel processing performance. They support up to 32 GB of energy-efficient and fast dual-channel DDR4 memory with up to 3200 MT / s, optionally also with ECC for highest data security. With a TDP scalable from 12 to 54 watts, the congatec modules based on these new processors benefit from numerous performance jumps at a given TDP as well as a huge SWaP-C optimization potential (size, weight, power and costs) with high graphics performance.

conga-TR4 Feature Highlights

- AMD V1000 processor Series with “Zen” core architecture
- up to 4 CPU cores
- “Vega” GPU with improved graphic performance
- Up to 32GByte dual channel DDR4 3200MT/s memory
- TDP scalable down to 12W
- up to 4 x 4K DP / eDP

The conga-TR4 COM Express Basic modules are therefore predestined for the development of embedded computing systems with impressive graphics performance, such as medical imaging systems, professional broadcasting, infotainment and gaming systems, digital signage systems, control centers and video surveillance, optical quality control and 3D simulators.

The conga-TR4 COM Express Type 6 Basic CPU-Module is available with the following CPU versions of the AMD Ryzen Embedded V1000 processor family:

AMD V1807B (4 x 3.35 GHz, 2MB L2 cache, 45W)
AMD V1756B (4 x 3.25 GHz, 2MB L2 cache, 45W)
AMD V1605B (4 x 2.0 GHz, 2MB L2 cache, 15W)
AMD V1202B (2 x 2.5 GHz, 1MB L2 cache, 15W)
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Customized Embedded Computing Solutions Customized Embedded Computing Solutions
Implementation of your product idea from concept to serial delivery .MCTX Mobile & Embedded Computers GmbH focuses on the integration of embedded computing hardware into customer-specific system solutions, whereby we work closely with leading manufacturers in this technology segment. Our portfolio ranges from technology consulting and the delivery of key components to the...
COM EXPRESS OEM Carrier Board Design Service COM EXPRESS OEM Carrier Board Design Service
On request, we can offer you the development and production of your application-specific COM Express Carrier Board and other services in the area of system integration. Here we fall back on experience and function blocks from designs that have already been implemented. The close interaction between development and production enables us to implement customer-specific systems...
Preferred Article Variant
conga-TEVAL/COMe 3.0 COM Express Type 6 Evaluation Carrier Board conga-TEVAL/COMe 3.0 COM Express Type 6...
Die Version conga-TEVAL2 / COMe 3.0 unterstützt neue Features wie z.B. einen M.2 Key B Steckplatz für Modulgrößen 3042, 2260 und 2280, USB 3.1, 3x Dual Mode Displayport und eDP. Für den schnellen Projektstart mit COM Express Typ 6 "Basic" und "Compact" CPU-Modulen bietet congatec das conga-TEVAL / COMe 3.0 Evaluation Carrier Board, das alle COM Express Signale an Standard-PC...
conga-TR4/V1202B conga-TR4/V1202B
COM Express Type 6 Basic Modul mit AMD embedded V-Series V1202B (Great Horned Owl) Dual-Core CPU mit 2.3GHz bis zu 3.2GHz Core-Frequenz, 1MB L2-Cache und 2400MT/s DDR4 SODIMM Speicherinterface für bis zu 32GB. Radeon Vega integrierten Grafik core mit 3 CU. TDP 12-25W.
Engineering Kits & Rapid Prototyping Engineering Kits & Rapid Prototyping
For evaluation, benchmark tests and so that our customers can start developing their application software as quickly as possible, we first implement a development kit ("Software Target") based on the intended key components. In the simplest case, this is based on the evaluation board from the manufacturer of the CPU platform in combination with additional standard hardware....
High Speed COM Express Connector, 8mm, 440pin, 16+ Gbit/s High Speed COM Express Connector, 8mm, 440pin,...
440pin Dual-Row High Speed COM Express Carrier Board Steckverbinder für 8mm Board-zu-Board-Abstand und Datenraten von bis zu 16+ Gbit/s. Typ: ept 401-55503-51 Für COM Express Type 7, Type 6 & Type 2 CPU Module.
High Speed COM Express Connector, 5mm, 440pin, 16+ Gbit/s High Speed COM Express Connector, 5mm, 440pin,...
440pin (Dual Row) 16+ Gbit/s High Speed COM Express Carrier Board Steckverbinder für 5mm Board-zu-Board-Abstand. Typ: ept 401-51503-51 Für COM Express Type 7, Type 6 & Type 2 CPU Module.
High Speed COM Express Connector, 5mm, 220pin, 16+ Gbit/s High Speed COM Express Connector, 5mm, 220pin,...
220pin 16+ Gbit/s High Speed COM Express Carrierboard Steckverbinder für 5 mm Board-zu-Board Abstand. Typ: 401-51103-51 Für COM Express Module Type 7, Type 6, Type 2 und COM Express Mini Type 10 CPU Module.
High Speed COM Express Connector 8mm, 220pin, 16+ Gbit/s High Speed COM Express Connector 8mm, 220pin,...
220pin 16+ Gbit/s High Speed COM Express Carrier Board Steckverbinder für 8mm board-to-board distance. Typ: ept 401-55103-51 Für COM Express Module Type 7, Type 6, Type 2 und COM Express Mini Type 10 CPU Module.
High Speed COM Express Connector, 8mm, 440pin, 10+ Gbit/s High Speed COM Express Connector, 8mm, 440pin,...
440pin Dual-Row High Speed COM Express Carrier Board Steckverbinder für 8mm Board-zu-Board-Abstand und Datenrate 10+ Gbit/s. Typ: ept 401-55501-51 Für COM Express Type 6 & Type 2 CPU Module.
conga-TR4 Cooling Solutions conga-TR4 Cooling Solutions
Heatspreader und Kuehlloesungen fuer congatec conga-TR4 CPU-Boards. Der zu verwendende Heatspreader- / Cooling Solution-Typ muss zum jeweiligen CPU-board passen. Die verfuegbaren Varianten und die Montageanleitungen finden Sie im Benutzerhandbuch des jeweiligen CPU-Boards.
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