conga-IC175 - Thin Mini ITX with Intel® "Kaby Lake" Core™ U

The extremely low profile conga-IC175 Thin Mini-ITX motherboards can be universally employed in all the various embedded and IoT applications as the new low-power versions of the high-end 64-bit Intel® Core™ processors offer a highly configurable thermal design power (TDP) of 15W, with the flexibility to scale dissipation from 7.5W cTDP to 25W cTDP.

Datasheet

Perfectly tailored for the embedded and rugged industrial market, the new flagship motherboard design offers at least 7 years long term availability as well as a comprehensive set of industrial interfaces and drivers. Two SO-DIMM sockets support up to 32GB DDR4-2133 memory. For non-volatile memory the boards offer 1x M.2 slot supporting the new Intel® Optane™ memory for significantly lower latency and higher data rates mass storage devices. 2x SATA 3.0 interfaces allow additional HDDs or SSDs to be connected. The IC175 connect the DirectX 12 capable Intel® HD Graphics 620 with up to three independent displays in 4k resolution @ 60 Hz via 2x DP++ plus eDP or dual channel LVDS. The industrial grade I/O set includes 2x Gigabit Ethernet and 1x SIM card socket for 3G/4G or Narrow Band M2M and IoT connectivity, 1x PCIe x4 and 1x mPCIe for generic expansions, 4x USB 3.0, 6x USB 2.0, 8x GPIO, and 2x serial COM ports – one of which can be configured as ccTalk.

The conga-IC175 Thin Mini-ITX SBC is available in the following Intel "Kaby Lake" CPU versions:

Intel® Core™ i5-7300U (2 x 2.6 / 3.5 GHz, 3MB Cache, 15W)
Intel® Core™ i3-7100U (2 x 2.4 GHz, 3MB Cache, 15W)
Intel® Celeron® 3965U (2 x 2.2 GHz, 2MB Cache, 15W)
Intel® Core™ i7-7600U (2 x 2.8 / 3.9 GHz, 4MB Cache, 15W)

The extremely low profile conga-IC175 Thin Mini-ITX motherboards can be universally employed in all the various embedded and IoT applications as the new low-power versions of the high-end 64-bit... read more »
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conga-IC175 - Thin Mini ITX with Intel® "Kaby Lake" Core™ U

The extremely low profile conga-IC175 Thin Mini-ITX motherboards can be universally employed in all the various embedded and IoT applications as the new low-power versions of the high-end 64-bit Intel® Core™ processors offer a highly configurable thermal design power (TDP) of 15W, with the flexibility to scale dissipation from 7.5W cTDP to 25W cTDP.

Datasheet

Perfectly tailored for the embedded and rugged industrial market, the new flagship motherboard design offers at least 7 years long term availability as well as a comprehensive set of industrial interfaces and drivers. Two SO-DIMM sockets support up to 32GB DDR4-2133 memory. For non-volatile memory the boards offer 1x M.2 slot supporting the new Intel® Optane™ memory for significantly lower latency and higher data rates mass storage devices. 2x SATA 3.0 interfaces allow additional HDDs or SSDs to be connected. The IC175 connect the DirectX 12 capable Intel® HD Graphics 620 with up to three independent displays in 4k resolution @ 60 Hz via 2x DP++ plus eDP or dual channel LVDS. The industrial grade I/O set includes 2x Gigabit Ethernet and 1x SIM card socket for 3G/4G or Narrow Band M2M and IoT connectivity, 1x PCIe x4 and 1x mPCIe for generic expansions, 4x USB 3.0, 6x USB 2.0, 8x GPIO, and 2x serial COM ports – one of which can be configured as ccTalk.

The conga-IC175 Thin Mini-ITX SBC is available in the following Intel "Kaby Lake" CPU versions:

Intel® Core™ i5-7300U (2 x 2.6 / 3.5 GHz, 3MB Cache, 15W)
Intel® Core™ i3-7100U (2 x 2.4 GHz, 3MB Cache, 15W)
Intel® Celeron® 3965U (2 x 2.2 GHz, 2MB Cache, 15W)
Intel® Core™ i7-7600U (2 x 2.8 / 3.9 GHz, 4MB Cache, 15W)

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