The highly scalable COM Express Type 6 Compact form factor offers a broad range of x86 CPU platforms, from the Intel® Atom ™ Family or AMD Embedded G-Series SoCs in the low end range to the Intel® Core i7 processors in the upper performance segment.
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COM Express Type 6 Compact module with Intel® Celeron® Processor 4305UE, dual core with 2.0GHz, 2MB L2 cache, GT1 graphics and 2400MT/s dual channel DDR4 memory interface (15W).
From €284.00 *
COM Express Type 6 Compact module with Intel® Celeron® 3965U dual core processor with 2.2GHz, 2MB Intel® Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
From €240.00 *
COM Express Compact module with Intel® Atom x7-E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Up to 5 PCI Express x1 lanes through PCI Express switch. Industrial grade temperature range from -40°C to 85°C.
From €240.00 *
conga-TEVAL/COMe 3.0 COM Express Type 6...
The conga-TEVAL/COMe 3.0 Evaluation Carrier Board for COM Express® Type 6 modules provides developers with a platform to jump-start the development of systems and applications based on COM Express specification. The enhanced Version conga-TEVAL2 / COMe 3.0 supports new Features like M.2 Key B Slot for M.2 Modules size 3042, 2260 and 2280, USB 3.1, 3x Dual Mode Displayport...
Cooling Solution TC170/CSA-B
Standard active cooling solution for COM Express modules conga-TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
Cooling Solution TC370/CSA-HP-B
Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm.
Cooling Solution TC370/CSP-HP-B
Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.
Standard heatspreader for COM Express Module conga-TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.
High Speed COM Express Connector, 5mm, 220pin,...
220pin 16+ Gbit/s High Speed COM Express Carrier board side Connector for 5 mm board-to-board distance. Type: ept 401-51103-51 For COM Express Type 7, Type 6, Type 2 and COM Express Mini Type 10 CPU Modules.
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