conga-TC370 - COM Express Compact Module with Intel® „Whiskey Lake U“ Core™ Mobile CPUs

The conga-TC370 COM Express Type 6 Modules are equipped with Intel Core Mobile "Whiskey Lake U" series CPUs.

Datasheet

Whiskey Lake U is the code name for Intel's line of low-power mobile processors based on the Whiskey Lake microarchitecture. Those processors are realized as a single-chip solution Whiskey Lake U parts are primarily targets mobile and embedded devices. The conga-TC370 board encapsulates the Whiskey Lake SoC on a standardized COM Express® Type 6 "Compact" Module with a size of 95 x 95mm and provides a complete processor subsystem on a small form factor. Due to its low power architecure and high performance scalability the conga-TC370 module variants can be applied to a wide variety of embedded computing applications and mobile computer systems.

conga-TC370 Feature Highlights:

  • 8th Generation Intel® Core™ SOC processor
  • up to 4 cores
  • Configuration of display mode by software (LVDS/eDP)
  • Low power consumption (TDP 15W, cTDP 10W)
  • Up to 64 GByte dual channel DDR4 2400 MT/s
  • Optional eMMC 5.1 on board mass storage
  • Trusted Platform Module (TPM 2.0)

Compared to previous geeneration CPUs the conga-TC370-Module offers an instant application performance boost of up to 40% – enabled by 4 instead of 2 cores plus an overall improved microarchitecture.

Correspondingly the memory interface is designed to match this performance boost: 2 DDR4 SODIMM sockets with up to 2400 MT/s throughput are available for a total of up to 64GB. Furthermore USB 3.1 Gen2 is now supported natively for the first time. This USB SuperSpeed+ interface is capable of transferring up to 10 Gbps, which makes it possible to transfer even uncompressed UHD video from a camera to a monitor.

Block diagram:

conga-TC370-congatec-com-express-compact-module-bd

 

conga-TEVAL COMe 3.0 Development Carrier Board

The conga-TEVAL Evaluation Carrierboard enables a quick development start with the conga-TC370. The conga-TEVAL carries all COM Express signals to standard PC plugs leads.

Heatspreader and cooling solutions

For the conga-TC370 COM Express module heatspreader and active (TC370-CSA) and passive (TC370-CSA) cooling solutions are available in different versions. The TC370 / HSP heat spreaders serve as a standardized thermal interface for implementing application-specific cooling concepts. All 3 solutions are available with either 2.7mm mounting holes ("-B" versions) or with M.2 threaded holes ("-T" versions) in the spacers.

The conga-TC370 COM Express Type 6 CPU-modules is available with the following processor versions:

Intel® Core™ i7-8665UE (4 x 1.7 GHz, 8MB cache, 15W)
Intel® Core™ i5-8365UE (4 x 1.6 GHz, 6MB cache, 15W)
Intel® Core™ i3-8145UE (2 x 2.2 GHz, 4MB cache, 15W)
Intel® Celeron® 4305UE (2 x 2.0 GHz, 2MB cache, 15W)
 
The conga-TC370 COM Express Type 6 Modules are equipped with Intel Core Mobile "Whiskey Lake U" series CPUs. Datasheet Whiskey Lake U is the code name for Intel's line of low-power... read more »
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conga-TC370 - COM Express Compact Module with Intel® „Whiskey Lake U“ Core™ Mobile CPUs

The conga-TC370 COM Express Type 6 Modules are equipped with Intel Core Mobile "Whiskey Lake U" series CPUs.

Datasheet

Whiskey Lake U is the code name for Intel's line of low-power mobile processors based on the Whiskey Lake microarchitecture. Those processors are realized as a single-chip solution Whiskey Lake U parts are primarily targets mobile and embedded devices. The conga-TC370 board encapsulates the Whiskey Lake SoC on a standardized COM Express® Type 6 "Compact" Module with a size of 95 x 95mm and provides a complete processor subsystem on a small form factor. Due to its low power architecure and high performance scalability the conga-TC370 module variants can be applied to a wide variety of embedded computing applications and mobile computer systems.

conga-TC370 Feature Highlights:

  • 8th Generation Intel® Core™ SOC processor
  • up to 4 cores
  • Configuration of display mode by software (LVDS/eDP)
  • Low power consumption (TDP 15W, cTDP 10W)
  • Up to 64 GByte dual channel DDR4 2400 MT/s
  • Optional eMMC 5.1 on board mass storage
  • Trusted Platform Module (TPM 2.0)

Compared to previous geeneration CPUs the conga-TC370-Module offers an instant application performance boost of up to 40% – enabled by 4 instead of 2 cores plus an overall improved microarchitecture.

Correspondingly the memory interface is designed to match this performance boost: 2 DDR4 SODIMM sockets with up to 2400 MT/s throughput are available for a total of up to 64GB. Furthermore USB 3.1 Gen2 is now supported natively for the first time. This USB SuperSpeed+ interface is capable of transferring up to 10 Gbps, which makes it possible to transfer even uncompressed UHD video from a camera to a monitor.

Block diagram:

conga-TC370-congatec-com-express-compact-module-bd

 

conga-TEVAL COMe 3.0 Development Carrier Board

The conga-TEVAL Evaluation Carrierboard enables a quick development start with the conga-TC370. The conga-TEVAL carries all COM Express signals to standard PC plugs leads.

Heatspreader and cooling solutions

For the conga-TC370 COM Express module heatspreader and active (TC370-CSA) and passive (TC370-CSA) cooling solutions are available in different versions. The TC370 / HSP heat spreaders serve as a standardized thermal interface for implementing application-specific cooling concepts. All 3 solutions are available with either 2.7mm mounting holes ("-B" versions) or with M.2 threaded holes ("-T" versions) in the spacers.

The conga-TC370 COM Express Type 6 CPU-modules is available with the following processor versions:

Intel® Core™ i7-8665UE (4 x 1.7 GHz, 8MB cache, 15W)
Intel® Core™ i5-8365UE (4 x 1.6 GHz, 6MB cache, 15W)
Intel® Core™ i3-8145UE (2 x 2.2 GHz, 4MB cache, 15W)
Intel® Celeron® 4305UE (2 x 2.0 GHz, 2MB cache, 15W)
 
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