The conga-TC370 COM Express Type 6 Modules are equipped with Intel Core Mobile "Whiskey Lake U" series CPUs.
Whiskey Lake U is the code name for Intel's line of low-power mobile processors based on the Whiskey Lake microarchitecture. Those processors are realized as a single-chip solution Whiskey Lake U parts are primarily targets mobile and embedded devices. The conga-TC370 board encapsulates the Whiskey Lake SoC on a standardized COM Express® Type 6 "Compact" Module with a size of 95 x 95mm and provides a complete processor subsystem on a small form factor. Due to its low power architecure and high performance scalability the conga-TC370 module variants can be applied to a wide variety of embedded computing applications and mobile computer systems.
conga-TC370 Feature Highlights:
- 8th Generation Intel® Core™ SOC processor
- up to 4 cores
- Configuration of display mode by software (LVDS/eDP)
- Low power consumption (TDP 15W, cTDP 10W)
- Up to 64 GByte dual channel DDR4 2400 MT/s
- Optional eMMC 5.1 on board mass storage
- Trusted Platform Module (TPM 2.0)
Compared to previous geeneration CPUs the conga-TC370-Module offers an instant application performance boost of up to 40% – enabled by 4 instead of 2 cores plus an overall improved microarchitecture.
Correspondingly the memory interface is designed to match this performance boost: 2 DDR4 SODIMM sockets with up to 2400 MT/s throughput are available for a total of up to 64GB. Furthermore USB 3.1 Gen2 is now supported natively for the first time. This USB SuperSpeed+ interface is capable of transferring up to 10 Gbps, which makes it possible to transfer even uncompressed UHD video from a camera to a monitor.
conga-TEVAL COMe 3.0 Development Carrier Board
The conga-TEVAL Evaluation Carrierboard enables a quick development start with the conga-TC370. The conga-TEVAL carries all COM Express signals to standard PC plugs leads.
Heatspreader and cooling solutions
For the conga-TC370 COM Express module heatspreader and active (TC370-CSA) and passive (TC370-CSA) cooling solutions are available in different versions. The TC370 / HSP heat spreaders serve as a standardized thermal interface for implementing application-specific cooling concepts. All 3 solutions are available with either 2.7mm mounting holes ("-B" versions) or with M.2 threaded holes ("-T" versions) in the spacers.
The conga-TC370 COM Express Type 6 CPU-modules is available with the following processor versions: