Heatspreader TC170/HSP-B

Heatspreader TC170/HSP-B

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  • Order number: 045230
  • System Integration Services: For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.
Description
Description
Standard heatspreader für COM Express Module conga-TC170 und TC175. Alle Distanzbolzen mit 2.7mm... more
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Product information "Heatspreader TC170/HSP-B"

Standard heatspreader für COM Express Module conga-TC170 und TC175. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.

Hersteller: congatec
Produkt-Typ: Computer-On-Module
Optional: MCTX Carrier Board Design & System Integration Services
Formfaktor: COM Express Compact Type 6
Produktfamilie: conga-TC175
Produkt: conga-TC170/HSP-B
Artikelnummer: 045230
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