Cooling Solution TC170/CSA-B

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Cooling Solution TC170/CSA-B
Cooling Solution TC170/CSA-B
   

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  • Order number: 045234
  • System Integration Services: For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.
Description
Description
Standard active Cooling Solution für COM Express Module conga-TC170 and TC175. Alle... more
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Product information "Cooling Solution TC170/CSA-B"

Standard active Cooling Solution für COM Express Module conga-TC170 and TC175. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung, 15mm Fins, 18mm Heatsink-Gesamthöhe und integriertem 12V-Lüfter.

Hersteller: congatec
Produkt-Typ: Computer-On-Module
Optional: MCTX Carrier Board Design & System Integration Services
Formfaktor: COM Express Compact Type 6
Produktfamilie: conga-TC175
Produkt: conga-TC170/CSA-B
Artikelnummer: 045234
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