Cooling Solution TC370/CSP-HP-B

Cooling Solution TC370/CSP-HP-B

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  • Order number: 048852
  • System Integration Services: For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.
Description
Description
Standard passive Cooling Solution für COM Express Compact Module conga-TC370 mit integrierten... more
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Product information "Cooling Solution TC370/CSP-HP-B"

Standard passive Cooling Solution für COM Express Compact Module conga-TC370 mit integrierten Heatpipesund 24.3mm overall cooling height. Durchsteckmontage miDistanzbolzen mit 2.7mm Bohrung.

Hersteller: congatec
Produkt-Typ: Computer-On-Module
Optional: MCTX Carrier Board Design & System Integration Services
Formfaktor: COM Express Compact Type 6
Produktfamilie: conga-TC370
Produkt: conga-TC370/CSP-HP-B
Artikelnummer: 048852
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