Qseven CPU-Modules for compact System Solutions.

The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor.

Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Q7 module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for PCI Express graphics cards in notebooks.

The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven... read more »
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Qseven CPU-Modules for compact System Solutions.

The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor.

Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Q7 module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for PCI Express graphics cards in notebooks.

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Cooling Solution QA5/CSP-B for N4200, N3350, J3455 Cooling Solution QA5/CSP-B for N4200, N3350, J3455
Passive Cooling Solution für Qseven Modul conga-QA5 mit open silicon Intel Pentium und Celeron Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.
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Cooling Solution QA5/i-CSP-T for E3950, E3940, E3930 Cooling Solution QA5/i-CSP-T for E3950, E3940,...
QA5/i-CSP-T Passive Cooling Solution für Qseven Modul conga-QA5 mit lidded Intel Atom Prozessor. Alle Distanzbolzen mit M2.5mm Gewinde.
Cooling Solution QA5/i-CSP-B for E3950, E3940, E3930 Cooling Solution QA5/i-CSP-B for E3950, E3940,...
Passive Cooling Solution für Qseven Modul conga-QA5 mit lidded Intel Atom Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.
Preferred Article Variant
Heatspreader QA5/HSP-T for N4200, N3350, J3455 Heatspreader QA5/HSP-T for N4200, N3350, J3455
Standard heatspreader für Qseven Modul conga-QA5 mit open silicon Intel Pentium und Celeron Prozessor. Alle Distanzbolzen mit M2.5mm Gewinde.
Heatspreader QA5/HSP-B for N4200, N3350, J3455 Heatspreader QA5/HSP-B for N4200, N3350, J3455
Standard heatspreader für Qseven Modul conga-QA5 mit open silicon Intel Pentium und Celeron Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.
conga-QMX8-Plus/HSP-T conga-QMX8-Plus/HSP-T
Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread.
conga-QMX8-Plus/HSP-B conga-QMX8-Plus/HSP-B
Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
Preferred Article Variant
Heatspreader QA5/i-HSP-T for E3950, E3940, E3930 Heatspreader QA5/i-HSP-T for E3950, E3940, E3930
Standard heatspreader für Qseven Modul conga-QA5 mit lidded Intel Atom Prozessor. Alle Distanzbolzen mit M2.5mm Gewinde.
Heatspreader QA5/i-HSP-B for E3950, E3940, E3930 Heatspreader QA5/i-HSP-B for E3950, E3940, E3930
Standard heatspreader für Qseven Modul conga-QA5 mit lidded Intel Atom Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.
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