conga-QMX8-Plus/HSP-B

conga-QMX8-Plus/HSP-B

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  • Order number: 016651
  • System Integration Services: For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.
Description
Description
Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All... more
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Product information "conga-QMX8-Plus/HSP-B"
Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
Formfaktor: Qseven
Hersteller: congatec
Produkt-Typ: Computer-On-Module
Optional: MCTX Carrier Board Design & System Integration Services
Produktfamilie: conga-QMX8-Plus
Produkt: conga-QMX8-Plus/HSP-B
Artikelnummer: 016651
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