Cooling Solution QA5/i-CSP-B for E3950, E3940, E3930

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Order number: 015531
System Integration Services: For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.

Passive Cooling Solution für Qseven Modul conga-QA5 mit lidded Intel Atom Prozessor. Alle... more

Product information "Cooling Solution QA5/i-CSP-B for E3950, E3940, E3930"

Passive Cooling Solution für Qseven Modul conga-QA5 mit lidded Intel Atom Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.

Formfaktor:	Qseven
Hersteller:	congatec
Produkt-Typ:	Computer-On-Module
Optional:	MCTX Carrier Board Design & System Integration Services
Produktfamilie:	conga-QA5
Produkt:	conga-QA5/i-CSP-B
Artikelnummer:	015531

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