conga-QEVAL/Qseven 2.0 Evaluation Carrier Board

conga-QEVAL/Qseven 2.0 Evaluation Carrier Board
€279.00 * €319.00 * (12.54% Saved)
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The conga-QEVAL / Qseven 2.0 Evaluation Carrier Board for congatec Qseven modules based on... more
Product information "conga-QEVAL/Qseven 2.0 Evaluation Carrier Board"

The conga-QEVAL / Qseven 2.0 Evaluation Carrier Board for congatec Qseven modules based on the industry standard Qseven 2.0 enables the quick start of development projects with Qseven modules.

Datasheet: conga-QEVAL/Qseven 2.0

User Manual conga-QEVAL Qseven 2.0

conga-QEVAL Interfaces

The connector layout picture below shows each connector and its name designator.

conga-QEVAL-qseven-2-0-interface-connectors

Qseven 2.0 - industry standard for miniaturized Computer-On-Modules

The manufacturer-independent industry standard Qseven offers a unique thermal interface optimized for fanless cooling. The current Qseven standard specifies embedded modules in the form factor of 70 mm x 70 mm and supports the x86 and ARM / RISC architecture. The COMs are designed for a maximum thermal design power (TDP) of 12W.

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