The conga-QEVAL / Qseven 2.0 Evaluation Carrier Board for congatec Qseven modules based on the industry standard Qseven 2.0 enables the quick start of development projects with Qseven modules.
The connector layout picture below shows each connector and its name designator.
Qseven 2.0 - industry standard for miniaturized Computer-On-Modules
The manufacturer-independent industry standard Qseven offers a unique thermal interface optimized for fanless cooling. The current Qseven standard specifies embedded modules in the form factor of 70 mm x 70 mm and supports the x86 and ARM / RISC architecture. The COMs are designed for a maximum thermal design power (TDP) of 12W.