SMARC 2.0 CPU modules for mobile applications and IoT

SMARC 2.0 is a new standard released by the Standardization Group for Embedded Technologies (SGET). With numerous graphics, camera, sound, networking and wireless interfaces, the SMARC 2.0 CPU modules are ideal for mobile IoT-connected multimedia platforms and many other low-power graphics-intensive applications. Thus, SMARC 2.0 positions itself exactly between the two already well established module standards Qseven and COM Express.

The technical highlights of SMARC 2.1

SMARC 2.0 modules stand out with their rich choice of graphics, camera, sound, network and optional wireless interfaces. They offer embedded system developers a complete, off-the-shelf, credit-card sized embedded computing core that is ideal for IoT connected multimedia platforms and many other graphics-intensive low-power applications.

SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well. 

The module power envelope is typically under 6W and the form factor is ideal for applications that mandate designs able to withstand extreme environmental conditions.

SMARC 2.0 White Paper

The updated specification SMARC 2.1 extends this feature set even further:

SMARC_2-1_2-0_comparsion

SMARC 2.0 is a new standard released by the Standardization Group for Embedded Technologies (SGET). With numerous graphics, camera, sound, networking and wireless interfaces, the SMARC 2.0 CPU... read more »
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SMARC 2.0 CPU modules for mobile applications and IoT

SMARC 2.0 is a new standard released by the Standardization Group for Embedded Technologies (SGET). With numerous graphics, camera, sound, networking and wireless interfaces, the SMARC 2.0 CPU modules are ideal for mobile IoT-connected multimedia platforms and many other low-power graphics-intensive applications. Thus, SMARC 2.0 positions itself exactly between the two already well established module standards Qseven and COM Express.

The technical highlights of SMARC 2.1

SMARC 2.0 modules stand out with their rich choice of graphics, camera, sound, network and optional wireless interfaces. They offer embedded system developers a complete, off-the-shelf, credit-card sized embedded computing core that is ideal for IoT connected multimedia platforms and many other graphics-intensive low-power applications.

SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well. 

The module power envelope is typically under 6W and the form factor is ideal for applications that mandate designs able to withstand extreme environmental conditions.

SMARC 2.0 White Paper

The updated specification SMARC 2.1 extends this feature set even further:

SMARC_2-1_2-0_comparsion

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conga-SMX8-Plus/HSP-B SMARC Module from congatec conga-SMX8-Plus product line. Part# 051351 conga-SMX8-Plus/HSP-B
Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
conga-SMX8/i-CSP-B SMARC Module from congatec conga-SMX8 product line. Part# 051050 conga-SMX8/i-CSP-B
Passive cooling solution for SMARC 2.0 module conga-SMX8 with lidded NXP i.MX 8 ARM processor. All standoffs are with 2.7mm bore hole.
conga-SMX8-Plus/CSP-B SMARC Module from congatec conga-SMX8-Plus product line. Part# 051350 conga-SMX8-Plus/CSP-B
Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
conga-SMX8-Mini/HSP-B SMARC Module from congatec conga-SMX8-Mini product line. Part# 051251 conga-SMX8-Mini/HSP-B
Heat spreader solution for SMARC 2.0 conga-SMX8-Mini with NXP i.MX 8M Mini ARM processor. All standoffs are with 2.7mm bore hole.
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Heatspreader SA5/i-HSP-B for E3950, E3940, E3930 Heatspreader SA5/i-HSP-B for E3950, E3940, E3930
Standard heatspreader für SMARC 2.0 Modul conga-SA5 mit lidded Intel Atom Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.
conga-SA7/i-HSP-B SMARC Module from congatec conga-SA7 product line. Part# 050151 conga-SA7/i-HSP-B
Standard heatspreader for SMARC 2.1 module conga-SA7 with lidded Intel Atom® x6000E processors. All standoffs are with 2.7mm bore hole.
conga-SMX8/i-HSP-B SMARC Module from congatec conga-SMX8 product line. Part# 051051 conga-SMX8/i-HSP-B
Heat spreader solution for SMARC 2.0 module conga-SMX8 with lidded NXP i.MX 8 ARM processor. All standoffs are with 2.7mm bore hole.
conga-SMX8-X/i-CSP-B SMARC Module from congatec conga-SMX8-X product line. Part# 051150 conga-SMX8-X/i-CSP-B
Passive cooling solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
conga-SMX8-X/i-HSP-B SMARC Module from congatec conga-SMX8-X product line. Part# 051151 conga-SMX8-X/i-HSP-B
Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
Heatspreader HSP SMARC-sXAL E2 Heatspreader HSP SMARC-sXAL E2
HSP SMARC-sXAL E2 - Heatspreader for Kontron SMARC-sXAL SMARC 2.0 CPU Module, industrial temperature. Kontron Part# 51008-0000-99-1
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