conga-SA7/i-HSP-B

Preview: conga-SA7/i-HSP-B SMARC Module from congatec conga-SA7 product line. Part# 050151 Preview: conga-SA7/i-HSP-B Preview: conga-SA7/i-HSP-B
conga-SA7/i-HSP-B SMARC Module from congatec conga-SA7 product line. Part# 050151
conga-SA7/i-HSP-B
conga-SA7/i-HSP-B
     

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  • Order number: 050151
  • System Integration Services: For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.
Description
Description
Standard heatspreader for SMARC 2.1 module conga-SA7 with lidded Intel Atom® x6000E processors.... more
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Product information "conga-SA7/i-HSP-B"
Standard heatspreader for SMARC 2.1 module conga-SA7 with lidded Intel Atom® x6000E processors. All standoffs are with 2.7mm bore hole.
Hersteller: congatec
Produkt-Typ: Computer-On-Module
Optional: MCTX Carrier Board Design & System Integration Services
Formfaktor: SMARC
Produktfamilie: conga-SA7
Produkt: conga-SA7/i-HSP-B
Artikelnummer: 050151
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