Cooling Solution TCA5/i-CSP-B for E3950, E3940, E3930

To be able to use Module Store - MCTX Mobile & Embedded Computers GmbH in full range, we recommend activating Javascript in your browser.

Order number: 048554
System Integration Services: For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.

Passive Cooling Solution für COM Express Compact Modul conga-TCA5 mit lidded Intel Atom... more

Product information "Cooling Solution TCA5/i-CSP-B for E3950, E3940, E3930"

Passive Cooling Solution für COM Express Compact Modul conga-TCA5 mit lidded Intel Atom Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.

Hersteller:	congatec
Produkt-Typ:	Computer-On-Module
Optional:	MCTX Carrier Board Design & System Integration Services
Formfaktor:	COM Express Compact Type 6
Produktfamilie:	conga-TCA5
Produkt:	conga-TCA5/i-CSP-B
Artikelnummer:	048554

Related links to "Cooling Solution TCA5/i-CSP-B for E3950, E3940, E3930"

Viewed