Cooling Solution B7XD/CSP-Cu-T

Cooling Solution B7XD/CSP-Cu-T

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  • Order number: 047538
  • System Integration Services: For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.
Description
Description
Standard passive cooling solution for low and mid range performance COM Express Type 7 module... more
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Product information "Cooling Solution B7XD/CSP-Cu-T"
Standard passive cooling solution for low and mid range performance COM Express Type 7 module conga-B7XD with integrated copper plate and 26mm overall heat sink height. Intended for modules with TDP up to 20W * Cu = Copper plate * T = M2.5 Threaded standoffs
Hersteller: congatec
Produkt-Typ: Computer-On-Module
Optional: MCTX Carrier Board Design & System Integration Services
Formfaktor: COM Express Basic Type 7
Produktfamilie: conga-B7XD
Produkt: conga-B7XD/CSP-Cu-T
Artikelnummer: 047538
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