Products from congatec
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conga-QMX8-Plus/HSP-T Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread.
conga-QMX8-Plus/HSP-B Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
conga-SMX8-Mini/i-Quad-4G eMMC16 SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.6GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.
- conga-SMX8-Mini/i-Quad-4G eMMC16 051220 €162.00 Details
- conga-SMX8-Mini/Quad-4G eMMC16 051200 €148.00 Details
- conga-SMX8-Mini/Dual-2G eMMC16 051201 €126.00 Details
- conga-SMX8-Mini/Solo-1G eMMC16 051202 €114.00 Details
- conga-SMX8-Mini/Quad-2G eMMC6 051203 €127.00 Details
- conga-SMX8-Mini/Quad-4G eMMC16 DP 051204 €153.00 Details
- conga-SMX8-Mini/i-Dual-2G eMMC16 051221 €135.00 Details
- conga-SMX8-Mini/i-Solo-1G eMMC16 051222 €124.00 Details
- conga-SMX8-Mini/i-Quad-2G eMMC16 051223 €136.00 Details
conga-SMX8-Mini/CSP-B Passive cooling solution for SMARC 2.0 module conga-SMX8-Mini with NXP i.MX 8M Mini ARM processor. All standoffs are with 2.7mm bore hole.
conga-SMX8-Mini/HSP-B Heat spreader solution for SMARC 2.0 conga-SMX8-Mini with NXP i.MX 8M Mini ARM processor. All standoffs are with 2.7mm bore hole.
conga-SMX8-Plus/i-QC-4G eMMC16 AW-CM276NF SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz + NPU +1x ARM Cortex-M7, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Extended temperature range from -25°C to 80°C. With AzureWave AW-CM276NF onboard Wifi/BT module (Business Case required for Wifi/BT option).
- conga-SMX8-Plus/i-QC-4G eMMC16 AW-CM276NF 051322 €196.00 Details
- conga-SMX8-Plus/QC-4G eMMC16 051300 €166.00 Details
- conga-SMX8-Plus/i-QC-4G eMMC16 051320 €178.00 Details
- conga-SMX8-Plus/i-QC-2G eMMC16 051321 €155.00 Details
conga-SMX8-Plus/CSP-B Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
conga-SMX8-Plus/HSP-B Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
conga-PA7 Cooling Solutions Heatspreader und Kuehlloesungen fuer congatec conga-PA7 CPU-Boards. Der zu verwendende Heatspreader- / Cooling Solution-Typ muss zum jeweiligen CPU-board passen. Die verfuegbaren Varianten und die Montageanleitungen finden Sie im Benutzerhandbuch des jeweiligen CPU-Boards.
- conga-PA7 Cooling Solutions PA7-coolings €1.00 Details
- conga-PA7/HSP-T 048950 €18.00 Details
- conga-PA7/CSP-T 048952 €21.00 Details
- conga-PA7/i-CSP-T 048953 €17.00 Details
- conga-PA7/HSP-B 048954 €18.00 Details
- conga-PA7/i-HSP-T 048951 €14.00 Details
- conga-PA7/i-HSP-B 048955 €14.00 Details
conga-TCV2 Cooling Solutions Heatspreader und Kuehlloesungen fuer congatec conga-TCV2 CPU-Boards. Der zu verwendende Heatspreader- / Cooling Solution-Typ muss zum jeweiligen CPU-board passen. Die verfuegbaren Varianten und die Montageanleitungen finden Sie im Benutzerhandbuch des jeweiligen CPU-Boards.
conga-TCA7 Cooling Solutions Heatspreader und Kuehlloesungen fuer congatec conga-TCA7 CPU-Boards. Der zu verwendende Heatspreader- / Cooling Solution-Typ muss zum jeweiligen CPU-board passen. Die verfuegbaren Varianten und die Montageanleitungen finden Sie im Benutzerhandbuch des jeweiligen CPU-Boards.
conga-TC570 Cooling Solutions Heatspreader und Kuehlloesungen fuer congatec conga-TC570 CPU-Boards. Der zu verwendende Heatspreader- / Cooling Solution-Typ muss zum jeweiligen CPU-board passen. Die verfuegbaren Varianten und die Montageanleitungen finden Sie im Benutzerhandbuch des jeweiligen CPU-Boards.
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