conga-TS570/HSP-HP-T

conga-TS570/HSP-HP-T

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  • Order number: 050755
  • System Integration Services: For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.
Description
Description
Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat... more
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Product information "conga-TS570/HSP-HP-T"

Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.

Hersteller: congatec
Produkt-Typ: Computer-On-Module
Optional: MCTX Carrier Board Design & System Integration Services
Formfaktor: COM Express Basic Type 6
Produktfamilie: conga-TS570
Produkt: conga-TS570/HSP-HP-T
Artikelnummer: 050755
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