conga-TS570/CSP-HP-T

conga-TS570/CSP-HP-T

Contact us for a project quote or if you have technical questions:

Product Inquiry

  • 050753
  • For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.
Standard passive cooling solution for high performance COM Express module conga-TS570 with... more
Product information "conga-TS570/CSP-HP-T"

Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are M2.5mm thread.

Hersteller: congatec
Produkt-Typ: Computer-On-Module
Optional: MCTX Carrier Board Design & System Integration Services
Formfaktor: COM Express Basic Type 6
Produktfamilie: conga-TS570
Produkt: conga-TS570/CSP-HP-T
Artikelnummer: 050753
Related links to "conga-TS570/CSP-HP-T"
Viewed