conga-TS175 Cooling Solutions

conga-TS175 Cooling Solutions

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  • TS175-coolings
  • For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.
Heatspreader und Kuehlloesungen fuer congatec conga-TS175 CPU-Boards. Der zu verwendende... more
Product information "conga-TS175 Cooling Solutions"
Heatspreader und Kuehlloesungen fuer congatec conga-TS175 CPU-Boards. Der zu verwendende Heatspreader- / Cooling Solution-Typ muss zum jeweiligen CPU-board passen. Die verfuegbaren Varianten und die Montageanleitungen finden Sie im Benutzerhandbuch des jeweiligen CPU-Boards.
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