conga-SA7/HSP-B

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  • 050152
  • For COM Express, COM-HPC, SMARC, Qseven and NVIDIA JETSON CPU modules, we offer the Engineering and Production of your application-specific Carrier Board and other System Integration Services on request. Here we draw on experience and function blocks from designs that have already been implemented. Our service portfolio can be found in the "System Integration" menu.
Standard heatspreader for SMARC 2.1 module conga-SA7 with open-die Intel® Pentium® and Celeron® J... more
Product information "conga-SA7/HSP-B"
Standard heatspreader for SMARC 2.1 module conga-SA7 with open-die Intel® Pentium® and Celeron® J and N processors. All standoffs are with 2.7mm bore hole.
Hersteller: congatec
Produkt-Typ: Computer-On-Module
Optional: MCTX Carrier Board Design & System Integration Services
Formfaktor: SMARC
Produktfamilie: conga-SA7
Produkt: conga-SA7/HSP-B
Artikelnummer: 050152
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