Passive cooling solution for SMARC 2.1 module conga-SA7 with open-die Intel® Pentium® and Celeron® J and N processorss. All standoffs are with 2.7mm bore hole.
Hersteller: | congatec |
Produkt-Typ: | Computer-On-Module |
Optional: | MCTX Carrier Board Design & System Integration Services |
Formfaktor: | SMARC |
Produktfamilie: | conga-SA7 |
Produkt: | conga-SA7/CSP-B |
Artikelnummer: | 050153 |
Related links to "conga-SA7/CSP-B"