Heatspreaders and Cooling Solutions for congatec COM Express Modules

Heatspreaders and Cooling Solutions for congatec COM Express Computer-On-Modules.

Heatspreaders and Cooling Solutions for congatec COM Express Computer-On-Modules. read more »
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Heatspreaders and Cooling Solutions for congatec COM Express Modules

Heatspreaders and Cooling Solutions for congatec COM Express Computer-On-Modules.

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Cooling Solution B7XD/CSA-HP-T Cooling Solution B7XD/CSA-HP-T
Standard active Cooling Solution für High Performance COM Express Type 7 Modul conga-B7XD mit integrierten Heatpipes, 70mm radial 12V PWM fan und 30mm Heatsink-Gesamthöhe. Alle Distanzbolzen mit 2.7mm Gewinde
Cooling Solution B7XD/CSA-HP-B Cooling Solution B7XD/CSA-HP-B
Standard active Cooling Solution für High Performance COM Express Type 7 Modul conga-B7XD mit integrierten Heatpipes, 70mm radial 12V PWM fan und 30mm Heatsink-Gesamthöhe. Alle Distanzbolzen mit M2.5mm Befestigungsbohrung.
Cooling Solution B7XD/CSA-Cu-B Cooling Solution B7XD/CSA-Cu-B
Standard active cooling solution for low and mid range performance COM Express Type 7 module conga-B7XD with integrated copper plate, 70mm 12V radial FAN and 27mm overall heat sink height. Intended for modules with TDP up to 35W * Cu = Copper plate * B = 2.7mm Bore hole standoffs
Cooling Solution B7XD/CSA-Cu-T Cooling Solution B7XD/CSA-Cu-T
Standard active cooling solution for low and mid range performance COM Express Type 7 module conga-B7XD with integrated copper plate, 70mm 12V radial FAN and 27mm overall heat sink height. Intended for modules with TDP up to 35W * Cu = Copper plate * T = M2.5 Threaded standoffs
Cooling Solution B7XD/CSP-Cu-B Cooling Solution B7XD/CSP-Cu-B
Standard passive cooling solution for low and mid range performance COM Express Type 7 module conga-B7XD with integrated copper plate and 26mm overall heat sink height. Intended for modules with TDP up to 20W * Cu = Copper plate * B = 2.7mm Bore hole standoffs
Cooling Solution B7XD/CSP-Cu-T Cooling Solution B7XD/CSP-Cu-T
Standard passive cooling solution for low and mid range performance COM Express Type 7 module conga-B7XD with integrated copper plate and 26mm overall heat sink height. Intended for modules with TDP up to 20W * Cu = Copper plate * T = M2.5 Threaded standoffs
Cooling Solution MA5/CSP-T for N4200, N3350 Cooling Solution MA5/CSP-T for N4200, N3350
Passive Cooling Solution für COM Express Mini Type 10 Modul conga-MA5 mit open silicon Intel Pentium und Celeron Prozessor. Alle Distanzbolzen mit M2.5mm Gewinde.
Cooling Solution MA5/CSP-B for N4200, N3350 Cooling Solution MA5/CSP-B for N4200, N3350
Passive Cooling Solution für COM Express Mini Type 10 Modul conga-MA5 mit open silicon Intel Pentium und Celeron Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.
Cooling Solution B7AC/CSA-Cu-B Cooling Solution B7AC/CSA-Cu-B
Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan * Cu = Copper plate * B = 2.7mm Bore hole standoffs
Cooling Solution B7AC/CSA-Cu-T Cooling Solution B7AC/CSA-Cu-T
Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan * Cu = Copper plate * T = M2.5 threaded standoffs
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